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History from 2026-05-06 to 2026-07-10. Every number below is a fact from TED/TenderNed notices — who this buyer awards to, what it buys, and what is open right now.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Canon Europa N.V. | 1 | €10.7M | 2026-05-06 |
| Pac Tech – Packaging Technologies GmbH | 1 | €1.3M | 2026-06-03 |
| TELTEC Semiconductor Technic GmbH | 1 | €718k | 2026-07-10 |
| FEI Europe B.V. Branch Austria | 1 | €243k | 2026-07-10 |
| PulseForge, Inc. | 1 | €214k | 2026-06-11 |
| budatec GmbH | 1 | €177k | 2026-06-17 |
| Published | Title | Outcome | Awarded |
|---|---|---|---|
| 2026-07-10 | Wartung - Scanning Electron Microscope | won by FEI Europe B.V. Branch Austria | €243,311 |
| 2026-07-10 | Silicon Austria Labs – Chips JU: Total Reflection X-Ray Fluorescence Spectrometer (TXRF) | won by TELTEC Semiconductor Technic GmbH | €718,200 |
| 2026-06-25 | Silicon Austria Labs – Magnetic Wafer Prober | cn-standard | — |
| 2026-06-17 | Silicon Austria Labs – Chips JU: Wafer Reflow Vacuum oven (manual or semi-automated) | won by budatec GmbH | €176,641 |
| 2026-06-11 | Silicon Austria Labs – Photonic debonder (manual/ semi-automated) | won by PulseForge, Inc. | €213,657 |
| 2026-06-05 | Silicon Austria Labs – Magnetic Wafer Prober | cn-standard | — |
| 2026-06-03 | Silicon Austria Labs – Chips JU: Wafer bumper | won by Pac Tech – Packaging Technologies GmbH | €1,260,320 |
| 2026-05-20 | Silicon Austria Labs – Magnetic thick film sputter tool | cn-standard | — |
| 2026-05-06 |
| Silicon Austria Labs – Chips JU: Magnetic thin film sputtering deposition equipment |
| won by Canon Europa N.V. |
| €10,718,844 |