Picosecond ultrasonics film thickness measurement tool
TED · 539615-2026Award noticeawardedNo deadline given
Who already wins at this buyer
Firms with recorded awards from TEKNOLOGIAN TUTKIMUSKESKUS VTT OY in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| DCA Instruments Oy | 2 | €4,297,905 | 2026-09-21 |
| LAM Research | 2 | — | 2026-10-29 |
| LAM Research Corporation | 2 | — | 2026-09-15 |
| KLA Corporation | 2 | — | 2026-09-07 |
| Keysight / Testhouse Nordic AB | 1 | €1,035,000 | 2026-05-06 |
Full buyer profile: what TEKNOLOGIAN TUTKIMUSKESKUS VTT OY buys and who wins it →
CPV codes
38300000 Laboratory, optical & precision equipmentDescription
Cassette-to-cassette measurement system using picosecond ultrasonics for materials characterization in semiconductor processes, enabling metal thickness metrology, implant monitoring, and thermal conductivity characterization.
Similar tenders
Closest by meaning — across languages, via embeddings.
| Published | Title | Buyer | Match |
|---|---|---|---|
| 2026-09-21 | Request for Quotation for the Provision of In-line Viscosity Sensor for Hot Melt Extrusion | Technological University of the Shannon: Midlands Midwest (TUSMM) IE | 87% |
| 2026-05-26 | Label-free detection system | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY FI | 86% |
| 2026-08-28 | Hall Effect Measurement System for Trinity College Dublin | Trinity College Dublin the University of Dublin_336 IE | 85% |
| 2026-06-16 | Ultrahigh resolution LC-MS instrument with ion mobility separation | Aarhus Universitet DK | 85% |
| 2026-08-12 | Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements | Silicon Austria Labs GmbH AT | 85% |
| 2026-05-27 | Manufacturing of monolithic sensors on undiced wafers | Kungliga Tekniska högskolan SE | 85% |