System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
TED · 399697-2026Contract noticeNo deadline given
Buyer
Name—
CountryDE
Published2026-06-11
Deadline—
Value
Estimated—
Awarded—
CPV codes
42990000 Industrial machineryDescription
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1)
Similar tenders
Closest by meaning — across languages, via embeddings.
| Published | Title | Buyer | Match |
|---|---|---|---|
| 2026-06-01 | Upgrade BEOL etching system (IPMS-CNT05.2) - PR874835-2480-P | — DE | 88% |
| 2026-06-30 | ALD System Upgrade (IPMS-CNT06.2) - PR867128-2480-P | — DE | 86% |
| 2026-06-11 | Prior Information Notice – Rapid Thermal Processing Equipment (RTA) | Ferdinand-Braun-Institut gGmbH Leibniz-Institut für Höchstfrequenztechnik DE | 86% |
| 2026-05-15 | High-performance imaging system for spatial proteomic profiling of tissue sections | Umeå universitet SE | 85% |
| 2026-05-20 | CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P | — DE | 85% |
| 2026-07-01 | Remote Plasma PVD Chamber (IPMS-CNT04.2) - PR917294-2480-P | — DE | 85% |